X870E AORUS PRO ICE NEW RYZEN MOTHERBOARD

GIGABYTE X870E AORUS PRO ICE: Master Next-Gen Ryzen Performance

Unleash the ultimate power with the GIGABYTE X870E AORUS PRO ICE motherboard. This stunning, white-themed ATX powerhouse is meticulously engineered. It’s designed to extract every ounce of performance from AMD’s latest Ryzen 7000, 8000, and the groundbreaking 9000 Series processors. With a relentless focus on extreme power delivery, advanced thermal solutions, and cutting-edge connectivity, the X870E AORUS PRO ICE is the definitive platform for elite gamers, visionary content creators, and discerning PC enthusiasts who demand absolute dominance and a captivating aesthetic.

Built for Ryzen’s Zenith: AM5 Platform Perfection

The X870E AORUS PRO ICE features the AMD AM5 socket. This ensures immediate and comprehensive compatibility with all current and next-generation AMD Ryzen processors.

This includes the mighty Ryzen 9 9950X and future Zen architecture CPUs. It enables you to harness unparalleled multi-core and single-core performance. GIGABYTE’s meticulous design ensures optimal communication and power delivery to these advanced CPUs. This guarantees rock-solid stability and maximum throughput for any demanding application.

The “E” in X870E AORUS PRO signifies Enhanced capabilities. This means more dedicated PCIe 5.0 lanes, directly from the CPU and chipset. It’s built for the highest tier of performance.

Unrivaled Power Delivery: Digital Twin 18+2+2 Phases VRM

At the very core of the X870E AORUS PRO ICE’s power lies its industry-leading Digital Twin 18+2+2 Phases VRM Solution. This robust power design incorporates high-current Smart Power Stage (SPS) MOSFETs. They are often rated at an impressive 110A per phase. This is alongside premium chokes and high-quality capacitors.

This immense power stage capacity ensures that even the most power-hungry Ryzen processors receive an incredibly stable, clean, and consistent power supply. This applies under extreme loads or aggressive precision boost conditions.

This stability is crucial for maximizing sustained boost clocks. It also enhances overclocking headroom. And it maintains system stability for both the CPU and high-speed DDR5 memory. The X870E AORUS PRO ICE guarantees peak performance around the clock.

The all-digital PWM controller, combined with these premium components, results in vastly superior power conversion efficiency. This translates to less wasted energy and lower heat generation within the VRM components. It also means a significantly extended lifespan for your motherboard, even under continuous heavy loads.

DDR5 Memory: Extreme Speed and Stability Beyond Limits

Experience the definitive future of memory with the X870E AORUS PRO ICE’s comprehensive DDR5 support. This motherboard features four Dual Channel DDR5 DIMM sockets. They are capable of supporting an astounding 256GB of RAM.

It offers an extensive range of DDR5 speeds. Validated overclocked frequencies are designed to reach an incredible 8200 MT/s and beyond. This is true even with 4-DIMM configurations. With 2-DIMM setups, expect potential speeds exceeding 9500 MT/s, pushing DDR5 to new frontiers.

The X870E AORUS PRO ICE seamlessly integrates AMD EXPO™ profiles (for AMD-optimized kits) and Intel® XMP (for universal kits). This allows for one-click optimization of your high-speed RAM.

GIGABYTE’s proprietary DDR5 Circuit Design and advanced DDR5 Auto Booster technologies further enhance memory overclocking performance and capability. This ensures optimal stability and blistering speed for your Ryzen processor.

Shielded Memory Routing & Low-Loss 8-Layer PCB: Advanced shielding within the PCB keeps memory signals clean and interference-free. The 8-layer server-grade PCB, featuring 2oz thickened copper and enhanced low-loss material, minimizes signal loss. This provides ultra-fast DDR5 data transmission and superior stability for extreme high-frequency memory. This meticulous engineering is a hallmark of the X870E AORUS PRO ICE.

PCIe 5.0 Everywhere: Graphics and Storage Unleashed with Unrivaled Bandwidth

The X870E AORUS PRO ICE embraces the full potential of PCIe 5.0. It offers unparalleled bandwidth for both graphics and storage, a defining feature of the X870E chipset.

Dual Full PCIe 5.0 x16 Slots with PCIe UD Slot X and EZ-Latch Plus: The X870E AORUS PRO ICE typically features two full-length PCIe 5.0 x16 slots. The primary slot operates at full x16 speeds, while the secondary can operate at x8/x8 when both are populated. This provides maximum bandwidth for dual-GPU configurations or a high-end GPU combined with a professional accelerator card.

PCIe UD Slot X: GIGABYTE’s enhanced PCIe UD Slot X offers unparalleled robustness. It features a 10x load-bearing capacity. It has an integrated single-piece design anchored to an exclusive backplate. An inner lining rubber strip safeguards your graphics card’s PCB. This provides superior durability for heavy GPUs.

EZ-Latch Plus: The innovative EZ-Latch Plus design simplifies the installation and removal of your graphics card and M.2 SSDs. This makes PC building, upgrading, and maintenance a significantly more user-friendly and hassle-free experience on the X870E AORUS PRO ICE.

Multiple PCIe 5.0 and PCIe 4.0 M.2 Storage Slots: Experience the definitive future of storage with the X870E AORUS PRO ICE’s robust M.2 configuration. It typically features at least four M.2 slots. At least two of these are PCIe 5.0 x4 M.2 connectors. These come directly from the CPU or chipset. One or more additional PCIe 4.0 x4 M.2 slots are included. This allows for extensive high-speed storage expansion.

Blistering Speeds: PCIe 5.0 NVMe SSDs deliver sequential read and write speeds that are double that of PCIe 4.0. This translates into near-instantaneous operating system boot times. It means virtually zero-latency game loading. And it dramatically reduces file transfer times for even the most colossal datasets. Imagine launching your entire game library in the blink of an eye. Or opening massive 8K creative projects in mere seconds.

M.2 Thermal Guard Extreme / AORUS Thermal Solutions: Each M.2 slot is equipped with advanced heatsinks. These include the massive M.2 Thermal Guard Extreme or AORUS Thermal Armor. They are designed to proactively prevent thermal throttling of your high-speed NVMe SSDs. This ensures your drives maintain their peak performance even under the most heavy and sustained workloads. It eliminates performance degradation due to heat.

Hyper-Speed Connectivity: The Revolution of WIFI 7 and Next-Gen I/O

The X870E AORUS PRO ICE redefines connectivity. It ensures you are always at the forefront of network and peripheral performance.

Integrated Wi-Fi 7 (802.11be) Module: Step into the future of wireless networking with the integrated Wi-Fi 7 module. This revolutionary standard offers unprecedented advancements over Wi-Fi 6E.

Multi-Link Operation (MLO): MLO allows simultaneous data transmission across multiple frequency bands (2.4GHz, 5GHz, and 6GHz). This aggregation of bandwidth dramatically boosts speeds. It reduces latency and significantly enhances reliability. This is crucial for competitive online gaming and demanding wireless applications like VR.

Blazing Multi-Gigabit Speeds: Wi-Fi 7 delivers theoretical maximum speeds reaching well over 5.8Gbps. This ensures lightning-fast downloads, seamless 4K/8K streaming, and rapid file transfers across your network.

Enhanced Capacity and Efficiency: Optimized for multi-device environments, Wi-Fi 7 offers superior network capacity and efficiency. This ensures smooth performance even with numerous connected devices simultaneously engaging in bandwidth-intensive activities.

Blazing Fast 5GbE LAN: For those who demand the utmost reliability and speed from a wired connection, the X870E AORUS PRO ICE integrates a high-performance 5 Gigabit Ethernet (5GbE LAN) port. This provides a 5x bandwidth increase over standard Gigabit Ethernet. It’s ideal for competitive online gaming where every millisecond counts. It’s also great for rapid local network file transfers and high-fidelity media streaming without bottlenecks.

Dual USB4 Ports with Type-C® (40Gbps): The X870E AORUS PRO ICE features Dual USB4 ports. These offer cutting-edge connectivity with blazing speeds of up to 40Gbps. These versatile USB Type-C® ports provide massive bandwidth. They are ideal for connecting the fastest external SSDs. They support high-resolution external displays (up to 8K) and sophisticated docking stations.

They also often support significant Power Delivery (PD) capabilities (e.g., 60W). This allows for rapid charging of compatible devices directly from your PC. DisplayPort Alt Mode enables direct video output over USB-C.

Comprehensive USB 3.2 Gen 2×2 (20Gbps) and Gen 2 (10Gbps) Connectivity: Beyond USB4, the motherboard provides a generous array of USB 3.2 Gen 2×2 (20Gbps) Type-C and multiple USB 3.2 Gen 2 (10Gbps) Type-A and Type-C ports. These are available both on the rear I/O and as internal headers for front panel connectivity. This ensures you have ample, high-bandwidth ports for all your modern peripherals, VR headsets, and external storage devices.

Revolutionary Thermal Design: Arctic-Cool Under Pressure

Sustained, high-octane performance from a powerful motherboard like the X870E AORUS PRO ICE is utterly unattainable without a profoundly effective and intelligently designed heat dissipation system. The AORUS PRO ICE is engineered with a revolutionary and comprehensive thermal design. It’s meticulously crafted to ensure your system remains arctic-cool, rock-stable, and performing optimally. This applies even during the most demanding, prolonged tasks and intense gaming marathons.

Extended & Fully Covered MOSFET Heatsinks with Direct Touch Heatpipe III: The X870E AORUS PRO ICE features massively extended and fully covered heatsinks. These directly contact the Voltage Regulator Modules (VRMs). The expansive surface area of these heatsinks, coupled with an advanced direct touch heatpipe system (Direct Touch Heatpipe III), efficiently dissipates this heat across a wider area. This prevents thermal throttling of the VRMs and ensures consistent, stable power delivery.

Premium 12 W/mk Thermal Conductivity Pads: Strategically placed 12 W/mk thermal pads represent the highest quality available. They ensure maximum heat transfer efficiency from the MOSFETs and other critical components to the heatsinks. These high-performance pads bridge any microscopic gaps. This ensures optimal thermal contact and vastly superior heat dissipation.

Integrated I/O Shield with Fins-Array III Design: Beyond its sleek aesthetic and protective function, the integrated I/O shield is designed with an enlarged surface area and a Fins-Array III design. This significantly increases the heat dissipation surface. This contributes to vastly improved airflow around the rear I/O ports. It actively aids in overall system cooling and heat exhaust.

Smart Fan 7 with Multi-Zone Temperature Sensors and FAN STOP: GIGABYTE’s next-generation Smart Fan 7 control system provides unparalleled and intelligent thermal management. It incorporates an expanded array of multiple, highly accurate temperature sensors. They are strategically placed across the motherboard. This allows for precise, real-time monitoring of every critical component.

The motherboard also features numerous hybrid fan headers. They intelligently support both PWM and DC fans. They also support high-power water cooling pumps (with robust 24W capacity and Over-Current Protection). The advanced FAN STOP feature allows individual fans to completely cease operation below a user-defined temperature threshold. This enables truly silent computing during light workloads. The intuitive and enhanced Smart Fan 7 BIOS UI provides granular, graphical control over fan curves. It empowers users to create highly customized and optimized cooling profiles for every conceivable scenario for their X870E AORUS PRO ICE system.

8-Layer PCB with 2oz Thickened Copper and Enhanced Low-Loss Material: The multi-layered Printed Circuit Board (PCB) design features an 8-layer construction with 2oz thickened copper. It uses enhanced server-grade, low-loss materials. This acts as a highly efficient heat dissipation pathway. This superior PCB construction helps to draw heat away from critical components across the entire board. It contributes significantly to the motherboard’s overall thermal management, rock-solid stability, and exceptional long-term durability.

Enhanced User Experience and Unwavering Durability: The AORUS Ultra Durable™ Philosophy

The X870E AORUS PRO ICE is the epitome of GIGABYTE’s renowned AORUS Ultra Durable™ philosophy. This is a commitment to long-term reliability, robust construction, and an intuitive, user-centric design. It defines the elite gaming and workstation experience.

Hi-Fi Audio with Premium ESS SABRE DAC and WIMA Audio Capacitors: Immerse yourself in breathtaking, high-fidelity audio with the integrated 8-channel HD audio solution. It’s powered by a premium Realtek ALC1220-VB (or similar high-end) codec AND an ESS SABRE DAC (Digital-to-Analog Converter). The X870E AORUS PRO ICE utilizes audiophile-grade WIMA capacitors and features an advanced Audio Noise Guard. This physically isolates the sensitive analog audio components from potential electromagnetic interference. This sophisticated design ensures a pristine, crystal-clear, and deeply immersive sound experience for gaming, cinematic content, and critical music listening.

Q-Flash Plus for Effortless BIOS Updates: An indispensable feature for builders and upgraders, Q-Flash Plus allows you to update the motherboard’s BIOS with unparalleled ease. No CPU, memory, or even a graphics card is necessary. Simply download the latest BIOS, place it on a USB drive, and activate the Q-Flash Plus button. This feature is invaluable for ensuring immediate compatibility with newer processors. It’s also great for effortlessly troubleshooting potential boot issues.

RGB FUSION 2.0 for Ultimate Personalized Aesthetics: Express your unique style and create a truly captivating visual experience with GIGABYTE’s advanced RGB FUSION 2.0 lighting system. The X870E AORUS PRO ICE includes multiple addressable LED headers and RGB LED headers. This allows you to connect and synchronize RGB lighting across a vast ecosystem of compatible components. These include CPU coolers, RGB fans, LED strips, and other peripherals. Create stunning, dynamic lighting effects and personalize your build to perfectly match your aesthetic preferences and gaming setup. This makes your rig a true showpiece.

AORUS Ultra Durable™ Construction and Reinforced Slots: Every single aspect of the X870E AORUS PRO ICE is meticulously engineered and constructed. This is done with an unwavering commitment to quality, reliability, and extreme durability. From the robust 8-layer PCB to the reinforced PCIe 5.0 x16 slot (with PCIe UD Slot X and EZ-Latch Plus) and the fortified DDR5 DIMM sockets with SMD design, the motherboard is designed to withstand the most rigorous demands of high-performance computing, frequent component changes, and long-term operation. This meticulous attention to detail ensures a rock-solid and highly reliable foundation for your PC for many years to come.

Technical Specifications Summary:

• CPU Support: AMD Socket AM5, supports AMD Ryzen™ 9000/8000/7000 Series Processors
• Chipset: AMD X870E
• VRM: Digital Twin 18+2+2 Phases VRM Solution (with 110A SPS MOSFETs)
• Memory: 4 x DIMM slots, Dual Channel DDR5, Max. 256GB, supports DDR5 up to 8200+MHz (OC) with AMD EXPO™ and XMP
• PCIe Slots:
  • 2 x PCIe 5.0 x16 slots (x16 or x8/x8 from CPU, with PCIe UD Slot X)
  • Additional PCIe 4.0/3.0 slots for expansion
• M.2 Storage:
  • Multiple M.2 slots, including at least 2 x PCIe 5.0 x4 M.2 connectors (from CPU/Chipset)
  • 2 or more x PCIe 4.0 x4 M.2 slots
  • Equipped with M.2 Thermal Guard Extreme / AORUS Thermal Solutions
• SATA Storage: 4 x SATA 6Gb/s connectors
• Networking:
  • Integrated Wi-Fi 7 (802.11be) Module
  • Intel/Realtek 5GbE LAN
  • Bluetooth 5.3
• USB Ports:
  • Rear Panel: Dual USB4 Type-C (40Gbps, with DP Alt Mode, PD support), multiple USB 3.2 Gen 2×2 (20Gbps) Type-C, USB 3.2 Gen 2 (10Gbps) Type-A/C, USB 3.2 Gen 1, USB 2.0/1.1
  • Internal Headers: USB 3.2 Gen 2×2 Type-C, USB 3.2 Gen 1, USB 2.0/1.1
• Audio: Premium Realtek ALC1220-VB (or similar high-end) CODEC + ESS SABRE DAC, 8-Channel HD Audio, WIMA Audio Capacitors, Audio Noise Guard
• BIOS: 256 Mbit flash, AMI UEFI BIOS, Q-Flash, Q-Flash Plus, Smart Backup, Intuitive UI
• Form Factor: ATX
• Thermal Features: Extended & Fully Covered MOSFET Heatsinks, Direct Touch Heatpipe III, 12 W/mk Thermal Conductivity Pads, Integrated I/O Shield with Fins-Array III Design, Smart Fan 7 with Multi-Zone Temperature Sensors and FAN STOP, 8-Layer PCB with 2oz Thickened Copper
• DIY Features: PCIe EZ-Latch Plus, M.2 EZ-Latch Click, M.2 EZ-Latch Plus, Q-Flash Plus, RGB FUSION 2.0 headers

Benefits of Choosing the X870E AORUS PRO ICE:

Ultimate Gaming Experience: The X870E AORUS PRO ICE provides the bedrock for an unparalleled gaming rig. Its robust power delivery ensures your CPU performs optimally. Dual PCIe 5.0 unlocks maximum performance from the latest GPUs and NVMe SSDs. Wi-Fi 7 and 5GbE LAN guarantee minimal latency for online gaming, giving you a crucial competitive edge.

Accelerated Content Creation: For professionals, this motherboard translates to dramatically reduced workflow times. High-speed DDR5 memory, multiple PCIe 5.0 M.2 slots, and ultra-fast USB4 ports significantly accelerate large file operations. This includes rendering and complex computations, maximizing your productivity.

Future-Proof Investment: The X870E AORUS PRO ICE is built on the cutting-edge AM5 platform. This ensures compatibility with future generations of AMD Ryzen processors. Its extensive support for PCIe 5.0 for both graphics and storage, along with DDR5 memory and Wi-Fi 7, ensures your system remains at the forefront of technology for years to come.

Exceptional Stability and Reliability: Thanks to its over-engineered VRM, advanced thermal design, and GIGABYTE’s Ultra Durable™ components, the X870E AORUS PRO ICE offers unwavering stability. This translates to fewer crashes, consistent performance under load, and a longer lifespan for your entire system, even under the most demanding conditions.

Effortless Building and Customization: Features like Q-Flash Plus and EZ-Latch Plus simplify the building and upgrading process. This makes it accessible even for novice builders. The intuitive BIOS and comprehensive RGB FUSION 2.0 controls allow for easy system configuration and personalized aesthetics. The striking ICE white aesthetic provides a perfect base for unique, high-end builds.

The GIGABYTE X870E AORUS PRO ICE motherboard is more than just a component; it’s a statement. It’s the definitive choice for anyone seeking to build a high-performance AMD Ryzen system. This system excels in every aspect, today and into the future, all while looking absolutely stunning.